[LAYER] Qualcomm platform support compatible with Clea OS

Supported platforms

• QCS6490
• QCS615

Supported boards

• RB3Gen2 Vision Kit
• QCS615 Automotive Development Platform (ADP) Air

Main software components

• Grub (grub-efi-seco 2.12, only QCS6490)
• Linux kernel
  • for QCS6490: custom Qualcomm kernel 6.6
  • for QCS615: upstream kernel 6.6
• Renesas USB firmware: proprietary firmware blob required for QCS6490
• Android Bootloader (ABL): Qualcomm bootloader temporarily used to boot QCS615

Boot modes

QCS6490

For QCS6490 two boot modes are supported:

• Qualcomm Linux boot mode (ENABLE_GRUB="0" in local.conf)
  • Limited support: in this mode, most Clea OS features are unsupported (e.g. sysdata, system update, ...)
  • Uses systemd-boot to boot a UKI image via EFI stub
  • Uses the Qualcomm Linux disk layout
• Clea OS boot mode (ENABLE_GRUB="1" in local.conf)
  • Complete support: this mode supports all Clea OS features
  • Uses grub as bootloader
  • Uses the configurable Clea OS disk layout (sysdata, redundant slots)
  • In this mode, a wic file is produced, and then each partition gets extracted from it into a separate file and all final build artifacts (including the updated QDL XMLs) are placed in ${DEPLOY_DIR_IMAGE}/seco-clea-os-image.

QCS615

Currently, for QCS615 only one boot mode is supported:

• ABL boot mode:
  • Limited support: in this mode, most Clea OS features are unsupported (e.g. sysdata, system update, ...)
  • Uses ABL to boot an Android-style boot.img file
  • Temporary: the boot process of this platform is expected to be aligned to QCS6490 following the next Qualcomm Linux release (1.5, end of June)

⚠ For systemd-boot and ABL boot modes, the rootfs is hardcoded in layer.conf